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Versatile modular connector Amphenol M032 suitable for aerospace industrial and military applications

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Versatile modular connector Amphenol M032 suitable for aerospace industrial and military applications

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Description : D-Sub, D-Shaped Connector Contacts RoHS

Mfr. Part # : M032

Model Number : M032

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Product Overview

Amphenol Socapex offers a comprehensive range of board-level interconnect solutions designed for high-density applications and harsh environments. The HiLinX series provides a 100% modular and hybrid connector system with various pitches (1.905mm and 2.54mm) and contact types, including signal, power, coaxial, and fiber optics. The HDAS series is a high-density monolithic connector with a staggered grid pattern (1.905 x 1.905mm) suitable for harsh environments, offering high performance and reliability. The SMASH series is a high-density interconnect system for harsh environments, featuring an aluminum shell and chevron grid pattern for high contact density. The SIAL series is a hybrid connector designed for use with thermal clamps, allowing for lateral displacement and offering a mix of signal and coaxial contacts. The SIHD series is a monolithic connector for use with thermal clamps, providing excellent electrical performance and high contact density with optional central ground strips. The 127/HE8 series is a proven, reliable, and robust connector with a 2.54mm staggered grid pitch, available in various configurations and compatible with MIL-DTL-55302 standards.

Product Attributes

  • Brand: Amphenol
  • Subsidiaries: Amphenol Socapex, Amphenol Aerospace Operations, Amphenol Backplane Systems, Amphenol Teradyne Connection Systems, Amphenol Printed Circuits
  • RoHS Compliance: Available for many product solutions

Technical Specifications

Product Series Key Features Pitch Contact Density Rows Signal Contacts Special Contacts Current Rating (Signal) Markets Served
HiLinX 2.54 Modular, hybrid, cost-effective, easy to install, highly reliable 2.54 x 2.54 [.100 x .100] staggered grid (1.27 [.050] offset) 0.11 cts/mm [71 cts/in] 2 or 3 10 to 170 Power, Coaxial, Amphelux 5 A Industrial, Commercial Avionics & Airframe, Military Avionics & Airframe, C4ISR, Navy
HiLinX 1.905 Modular, hybrid, cost-effective, easy to install, highly reliable 1.905 x 1.905 [.075 x .075] staggered grid (0.9525 [.0375] offset) 0.16 cts/mm [103 cts/in] 2 or 3 10 to 206 Power, Coaxial, Amphelux, RADSOK 3 A Industrial, Commercial Avionics & Airframe, Military Avionics & Airframe, C4ISR, Navy
HDAS High density monolithic, robust, simple design, high performance to extreme conditions 1.905 x 1.905 [.075 x .075] staggered grid (0.9525 [.0375] offset) 0.16 cts/mm [103 cts/in] 3 to 6 50 to 402 Power 4.5 A Commercial Avionics & Airframe, Military Avionics & Airframe, C4ISR, Navy, Ground vehicles, Industrial
SMASH High density interconnect system for harsh environments, robust, high signal integrity 1.905 x 1.905 [.075 x .075] chevron grid 0.34 cts/mm [130 cts/in] 6 or 8 rows (per bay) Up to 450 (150 per bay) RF, Power, Fiber Optics, LVDS 3 A Military Avionics & Airframe, Commercial Avionics & Airframe, C4ISR
SIAL Hybrid connector, modular, lateral displacement capability (0.25 [.010]) 2.54 x 1.905 [.100 x .075] staggered grid (1.27 [.050] offset) 0.14 cts/mm [90 cts/in] 5 18 to 392 Coaxial (Size 12 & 16) 3 A Military Avionics & Airframe, Commercial Avionics & Airframe, Space
SIHD Monolithic connector, high contact density, robust, withstands extreme conditions, lateral displacement (0.25 [.010]), optional central ground strip 2.54 x 1.905 [.100 x .075] staggered grid (1.27 [.050] offset), 1.905 [.075] between rows 0.14 cts/mm [90 cts/in] 5 102 to 390 Ground Strips 3 A Commercial Avionics & Airframe, Military Avionics & Airframe, Navy, Space
127 / HE8 Proven, reliable, robust, medium-density, low profile 2.54 x 2.54 [.100 x .100] staggered grid (1.27 [.050] offset), 2.54 [.100] between rows 0.11 cts/mm [71 cts/in] 2 or 3 17 to 144 Power (10A & 20A), Coaxial, Optical termini 3 A Military Avionics & Airframe, Commercial Avionics & Airframe, C4ISR, Ground vehicles, Industrial
HDB3 / HSB3 Brush contact technology, higher density, lower mated height, higher speed HDB3: .070 inch x .060inch staggered grid; HSB3: Higher density than HDB3 Higher density 8 rows (LRM) Up to 180 (LRM) Power, Fiber Optics, RF, High Speed, RADSOK Varies by contact type Commercial Avionics & Airframe, Military Avionics & Airframe, C4ISR, Navy, Ground vehicles, Space
LRM High-density, flexible design, SEM-E form factors, ESD protection, LVDS available 8 rows: 0.100 inch spacing along row, 0.050 inch between rows, rows offset 0.050 inch High contact density 8 rows Up to 180 digital brush contacts Power, Fiber Optics, RF, High Speed, RADSOK Varies by contact type Military Avionics & Airframe, Commercial Avionics & Airframe, C4ISR, Ground vehicles, Space
Ruggedized VME64x Metal shells, robust contact system, 3 module inserts in unified shell Standard VME64x N/A N/A N/A N/A N/A Commercial Avionics & Airframe, Military Avionics & Airframe, C4ISR, Ground vehicles
VIPER (VITA 46, 48, 60) Shielded, high-density, high-speed modular interconnect, press fit terminations, 0.520 mm nominal translation 1.8mm x 1.35mm grid (daughtercard) High density N/A 70 single-ended, 63 differential Power 1 A (signal), 12 A (power wafer) Military Avionics & Airframe, Commercial Avionics & Airframe, C4ISR, Ground vehicles
High Speed Interconnects (XCede, GbX, VHDM, Aptera, etc.) Various high-speed data rates (2.5 Gbps to 20+ Gbps), various configurations (co-planar, mezzanine, stacker, cable assemblies) Varies by series (e.g., 1.25mm, 1.85mm, 1.905mm) High density Varies by series Varies by series Power, Guidance, Polarizing Varies by series Backplane, Orthogonal, Co-planar, Mezzanine, Cable Assemblies
Printed Circuit Boards (Rigid, Flexible, Rigid-Flex) High-bandwidth, mission-critical applications, advanced technologies (blind/buried vias, microvias) Varies High density Up to 64 layers N/A N/A N/A N/A

2506271433_Amphenol-M032_C20215393.pdf


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